JPH0513382B2 - - Google Patents

Info

Publication number
JPH0513382B2
JPH0513382B2 JP60138821A JP13882185A JPH0513382B2 JP H0513382 B2 JPH0513382 B2 JP H0513382B2 JP 60138821 A JP60138821 A JP 60138821A JP 13882185 A JP13882185 A JP 13882185A JP H0513382 B2 JPH0513382 B2 JP H0513382B2
Authority
JP
Japan
Prior art keywords
heat
adhesive
lead
tab
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60138821A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61296749A (ja
Inventor
Katsutoshi Mine
Kazumi Nakayoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Priority to JP60138821A priority Critical patent/JPS61296749A/ja
Priority to US06/873,577 priority patent/US4721994A/en
Priority to EP86304805A priority patent/EP0209265B1/en
Priority to DE8686304805T priority patent/DE3680723D1/de
Publication of JPS61296749A publication Critical patent/JPS61296749A/ja
Publication of JPH0513382B2 publication Critical patent/JPH0513382B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60138821A 1985-06-25 1985-06-25 半導体装置用リードフレームの製造方法 Granted JPS61296749A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60138821A JPS61296749A (ja) 1985-06-25 1985-06-25 半導体装置用リードフレームの製造方法
US06/873,577 US4721994A (en) 1985-06-25 1986-06-12 Lead frame for semiconductor devices
EP86304805A EP0209265B1 (en) 1985-06-25 1986-06-23 Lead frame for semiconductor devices
DE8686304805T DE3680723D1 (de) 1985-06-25 1986-06-23 Leiterrahmen fuer halbleiter.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60138821A JPS61296749A (ja) 1985-06-25 1985-06-25 半導体装置用リードフレームの製造方法

Publications (2)

Publication Number Publication Date
JPS61296749A JPS61296749A (ja) 1986-12-27
JPH0513382B2 true JPH0513382B2 (en]) 1993-02-22

Family

ID=15231014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60138821A Granted JPS61296749A (ja) 1985-06-25 1985-06-25 半導体装置用リードフレームの製造方法

Country Status (4)

Country Link
US (1) US4721994A (en])
EP (1) EP0209265B1 (en])
JP (1) JPS61296749A (en])
DE (1) DE3680723D1 (en])

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4859632A (en) * 1987-12-28 1989-08-22 Siemens Corporate Research And Support, Inc. Method for manufacturing the same
US4832996A (en) * 1988-02-24 1989-05-23 Motorola, Inc. Semiconductor die for plastic encapsulation having an adhesion promoter
US5278101A (en) * 1989-06-28 1994-01-11 Kabushiki Kaisha Toshiba Semiconductor device and method for manufacturing the same
JP2882823B2 (ja) * 1989-11-15 1999-04-12 東レ・ダウコーニング・シリコーン株式会社 接着剤
JP2974700B2 (ja) * 1989-11-30 1999-11-10 東レ・ダウコーニング・シリコーン株式会社 導電性接着剤
JPH0724270B2 (ja) * 1989-12-14 1995-03-15 株式会社東芝 半導体装置及びその製造方法
US5232959A (en) * 1990-05-25 1993-08-03 Dow Corning Toray Silicone Co., Ltd. Organohydrogenpolysiloxanes and curable organosiloxane compositions containing same
DE4041346B4 (de) * 1990-12-21 2005-10-06 Infineon Technologies Ag Standard-Kunststoffgehäuse mit darin verkapselten Halbleiterchips
US5229329A (en) * 1991-02-28 1993-07-20 Texas Instruments, Incorporated Method of manufacturing insulated lead frame for integrated circuits
WO1992016970A1 (en) * 1991-03-12 1992-10-01 Sumitomo Bakelite Company Limited Method of manufacturing two-layer tab tape
JP2927982B2 (ja) * 1991-03-18 1999-07-28 ジャパンゴアテックス株式会社 半導体装置
US5164817A (en) * 1991-08-14 1992-11-17 Vlsi Technology, Inc. Distributed clock tree scheme in semiconductor packages
US5231755A (en) * 1991-08-20 1993-08-03 Emanuel Technology, Inc. Method of forming soluble alignment bars
US5177591A (en) * 1991-08-20 1993-01-05 Emanuel Norbert T Multi-layered fluid soluble alignment bars
US5360946A (en) * 1991-09-17 1994-11-01 International Business Machines Corporation Flex tape protective coating
US5359225A (en) * 1992-11-06 1994-10-25 Intel Corporation Thin, high leadcount package
US5294827A (en) * 1992-12-14 1994-03-15 Motorola, Inc. Semiconductor device having thin package body and method for making the same
US5336564A (en) * 1993-12-06 1994-08-09 Grumman Aerospace Corporation Miniature keeper bar
US5905300A (en) * 1994-03-31 1999-05-18 Vlsi Technology, Inc. Reinforced leadframe to substrate attachment
WO1995028740A1 (en) * 1994-04-14 1995-10-26 Olin Corporation Electronic package having improved wire bonding capability
US5512780A (en) * 1994-09-09 1996-04-30 Sun Microsystems, Inc. Inorganic chip-to-package interconnection circuit
US5567654A (en) * 1994-09-28 1996-10-22 International Business Machines Corporation Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
US5545850A (en) * 1995-01-13 1996-08-13 Olin Corporation Guard ring for integrated circuit package
US5939775A (en) * 1996-11-05 1999-08-17 Gcb Technologies, Llc Leadframe structure and process for packaging intergrated circuits
WO1998029899A2 (en) * 1996-12-19 1998-07-09 Gcb Technologies, Llc Improved leadframe structure with locked inner leads and process for manufacturing same
US6509632B1 (en) * 1998-01-30 2003-01-21 Micron Technology, Inc. Method of fabricating a redundant pinout configuration for signal enhancement in an IC package
US6121674A (en) 1998-02-23 2000-09-19 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
US6977214B2 (en) * 1998-12-11 2005-12-20 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
DE19927108C2 (de) * 1999-06-14 2001-06-28 Heraeus Electro Nite Int Verfahren zur Herstellung von Sensoren, insbesondere Temperatursensoren
US6503847B2 (en) * 2001-04-26 2003-01-07 Institute Of Microelectronics Room temperature wafer-to-wafer bonding by polydimethylsiloxane
CN114300365B (zh) * 2021-11-27 2023-01-03 昆山弗莱吉电子科技有限公司 铜合金引线框架的后处理工艺以及铜合金引线框架

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng
US3763404A (en) * 1968-03-01 1973-10-02 Gen Electric Semiconductor devices and manufacture thereof
US3711625A (en) * 1971-03-31 1973-01-16 Microsystems Int Ltd Plastic support means for lead frame ends
US4063993A (en) * 1975-07-07 1977-12-20 National Semiconductor Corporation Method of making gang bonding interconnect tape for semiconductive devices
US4089733A (en) * 1975-09-12 1978-05-16 Amp Incorporated Method of forming complex shaped metal-plastic composite lead frames for IC packaging
US4204317A (en) * 1977-11-18 1980-05-27 The Arnold Engineering Company Method of making a lead frame
JPS5488268U (en]) * 1977-12-05 1979-06-22
JPS5577865U (en]) * 1978-11-25 1980-05-29
JPS55112860U (en]) * 1979-02-02 1980-08-08
DE2940917A1 (de) * 1979-10-09 1981-04-23 Wacker-Chemie GmbH, 8000 München Klebstoffe
JPS5695974A (en) * 1979-12-28 1981-08-03 Shin Etsu Chem Co Ltd Releasable silicone type adhesive base
JPS56103264A (en) * 1980-01-21 1981-08-18 Toray Silicone Co Ltd Silicone compositin for adhesive
JPS58143541A (ja) * 1982-02-22 1983-08-26 Hitachi Ltd 半導体装置
JPS58161349A (ja) * 1982-03-19 1983-09-24 Hitachi Ltd 半導体装置およびその製造方法
JPS58178544A (ja) * 1982-04-12 1983-10-19 Matsushita Electronics Corp リ−ドフレ−ム
US4567545A (en) * 1983-05-18 1986-01-28 Mettler Rollin W Jun Integrated circuit module and method of making same
JPS6038825A (ja) * 1983-08-11 1985-02-28 Sumitomo Metal Mining Co Ltd テ−プ貼着装置
FR2568059A1 (fr) * 1984-07-23 1986-01-24 Rogers Corp Procede et dispositif de fixation d'une structure de fils conducteurs

Also Published As

Publication number Publication date
EP0209265B1 (en) 1991-08-07
US4721994A (en) 1988-01-26
DE3680723D1 (de) 1991-09-12
EP0209265A1 (en) 1987-01-21
JPS61296749A (ja) 1986-12-27

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